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Breakthrough Epoxy Flux Technology from Henkel Offers Cost-Effective Single Material Solution for Advanced Package Configurations
21.04.08 - 21:59 ... source : Henkel
... In what is truly a ground breaking material advance, Henkel Corporation has developed a new reflow cured encapsulant material that combines flux functionality and underfill protection into a single material. In what is truly a ground breaking material advance, Henkel Corporation has developed a new reflow cured encapsulant material that combines flux functionality and underfill protection into a single material. The breakthough product, Hysol® FF6000™, is a reflow curable material that is formulated to provide flux for lead-free solder joint formation and, when cured, delivers protection against mechanical stress. Unlike traditional capillary underfill processes in which the device is mounted onto the printed circuit board, the assembly is reflowed and then the device is underfilled, Hysol FF6000 enables an in-line alternative that affords thoroug ...» Next (HTML)
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